Memory
TC571000D-200
Toshiba America Electronic Components
Description: IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM

Overview of TC571000D-200 by Toshiba America Electronic Components

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Where used in Applications: Consumer Electronics Space Technology Computing and Data Storage Aerospace and Defense

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Part Data Attributes for TC571000D-200 by Toshiba America Electronic Components

TC571000D-200
Toshiba America Electronic Components
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
TOSHIBA CORP
Part Package Code
DIP
Package Description
WDIP,
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
200 ns
JESD-30 Code
R-GDIP-T32
JESD-609 Code
e0
Length
42 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
6.1 mm
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. TC571000D-200
    Toshiba America Electronic Components
    IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM
    VS

Alternate Parts for TC571000D-200

This table gives cross-reference parts and alternative options found for TC571000D-200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC571000D-200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AT27CL010-20DM/883 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation TC571000D-200 vs AT27CL010-20DM/883
M27C1001-20XF1 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics TC571000D-200 vs M27C1001-20XF1
AM27C010-200DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion TC571000D-200 vs AM27C010-200DC
DPV27C101-200B UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company TC571000D-200 vs DPV27C101-200B
5962-8961403XA UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD TC571000D-200 vs 5962-8961403XA
AT27LV010-20DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation TC571000D-200 vs AT27LV010-20DC
AM27C010-200DEB UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD TC571000D-200 vs AM27C010-200DEB
NMC27C010Q20 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 Texas Instruments TC571000D-200 vs NMC27C010Q20
DPV27C101-200C UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company TC571000D-200 vs DPV27C101-200C
AM27C010-200DEB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion TC571000D-200 vs AM27C010-200DEB
Part Number Description Manufacturer Compare
AM27C100-200DIB UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD TC571000D-200 vs AM27C100-200DIB
NM27C010QE200 UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 Fairchild Semiconductor Corporation TC571000D-200 vs NM27C010QE200
AM27C010-200DIB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion TC571000D-200 vs AM27C010-200DIB
27C100-200V10 UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Intel Corporation TC571000D-200 vs 27C100-200V10
AM27C010-200DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion TC571000D-200 vs AM27C010-200DC
HN27C301AG-20 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation TC571000D-200 vs HN27C301AG-20
TMS27C010A-20JE 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Texas Instruments TC571000D-200 vs TMS27C010A-20JE
AM27C010-205DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD TC571000D-200 vs AM27C010-205DC
AT27CL010-20DM/883 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation TC571000D-200 vs AT27CL010-20DM/883
M27C1001-20XF1 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics TC571000D-200 vs M27C1001-20XF1

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