Part Details for TC55329AP-35 by Toshiba America Electronic Components
Overview of TC55329AP-35 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TC55329AP-35
TC55329AP-35 CAD Models
TC55329AP-35 Part Data Attributes
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TC55329AP-35
Toshiba America Electronic Components
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Datasheet
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TC55329AP-35
Toshiba America Electronic Components
IC 32K X 9 CACHE SRAM, 35 ns, PDIP32, 0.300 INCH, PLASTIC, DIP-32, Static RAM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | DIP | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| Length | 40 mm | |
| Memory Density | 294912 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX9 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.45 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for TC55329AP-35
This table gives cross-reference parts and alternative options found for TC55329AP-35. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55329AP-35, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MCM62L05CP20 | Standard SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Motorola Semiconductor Products | TC55329AP-35 vs MCM62L05CP20 |
| SRM20259LC10 | Standard SRAM, 32KX9, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Seiko Epson Corporation | TC55329AP-35 vs SRM20259LC10 |
| CY7C188-25PC | Standard SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Cypress Semiconductor | TC55329AP-35 vs CY7C188-25PC |
| MB8289-35PSK | 32KX9 STANDARD SRAM, 35ns, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 | FUJITSU Limited | TC55329AP-35 vs MB8289-35PSK |
| QS83291-40P | Cache SRAM, 32KX9, CMOS, PDIP32, | Quality Semiconductor Inc | TC55329AP-35 vs QS83291-40P |
| M5M52B79P-12 | Standard SRAM, 32KX9, 12ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Mitsubishi Electric | TC55329AP-35 vs M5M52B79P-12 |
| QS83290-30D6 | Cache Tag SRAM, 32KX9, 30ns, CMOS, CDIP32, | Quality Semiconductor Inc | TC55329AP-35 vs QS83290-30D6 |
| IDT71589S25D | Cache Tag SRAM, 32KX9, 24ns, CMOS, CDIP32, 0.300 INCH, HERMETIC SEALED, CERDIP-32 | Integrated Device Technology Inc | TC55329AP-35 vs IDT71589S25D |
| IDT71509L45C | Standard SRAM, 32KX9, 45ns, CMOS, CDIP32, 0.300 INCH, SIDE BRAZED, DIP-32 | Integrated Device Technology Inc | TC55329AP-35 vs IDT71509L45C |
| QS83290-20P | Cache Tag SRAM, 32KX9, 20ns, CMOS, PDIP32, | Quality Semiconductor Inc | TC55329AP-35 vs QS83290-20P |