Part Details for SSTUB32864EC/G,518 by NXP Semiconductors
Overview of SSTUB32864EC/G,518 by NXP Semiconductors
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Part Details for SSTUB32864EC/G,518
SSTUB32864EC/G,518 CAD Models
SSTUB32864EC/G,518 Part Data Attributes:
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SSTUB32864EC/G,518
NXP Semiconductors
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SSTUB32864EC/G,518
NXP Semiconductors
SSTUB32864 - 1.8 V configurable registered buffer for DDR2-800 RDIMM applications BGA 96-Pin
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 | |
| Pin Count | 96 | |
| Manufacturer Package Code | SOT536-1 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Family | 32864 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13.5 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Moisture Sensitivity Level | 2 | |
| Number of Bits | 14 | |
| Number of Functions | 1 | |
| Number of Terminals | 96 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Polarity | COMPLEMENTARY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Propagation Delay (tpd) | 1.5 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Trigger Type | POSITIVE EDGE | |
| Width | 5.5 mm | |
| fmax-Min | 450 MHz |