Part Details for SMJ55161AHKC-75 by Micross Components
Overview of SMJ55161AHKC-75 by Micross Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for SMJ55161AHKC-75
SMJ55161AHKC-75 CAD Models
SMJ55161AHKC-75 Part Data Attributes
|
|
SMJ55161AHKC-75
Micross Components
Buy Now
Datasheet
|
Compare Parts:
SMJ55161AHKC-75
Micross Components
Memory Circuit, 256KX16, CQFP64
|
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | MICROSS COMPONENTS | |
| Package Description | GQFF, TPAK64,1.6SQ,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 75 ns | |
| JESD-30 Code | S-XQFP-F64 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Terminals | 64 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX16 | |
| Package Body Material | CERAMIC | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK64,1.6SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.012 A | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Temperature Grade | MILITARY | |
| Terminal Form | FLAT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD |