Part Details for SMJ55161AGB-75 by Micross Components
Overview of SMJ55161AGB-75 by Micross Components
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Part Details for SMJ55161AGB-75
SMJ55161AGB-75 CAD Models
SMJ55161AGB-75 Part Data Attributes
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SMJ55161AGB-75
Micross Components
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Datasheet
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SMJ55161AGB-75
Micross Components
Memory Circuit, 256KX16, PPGA68
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Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | MICROSS COMPONENTS | |
Package Description | PGA, PGA68,9X9 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 75 ns | |
JESD-30 Code | S-PPGA-P68 | |
Memory Density | 4194304 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Terminals | 68 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | PGA | |
Package Equivalence Code | PGA68,9X9 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Standby Current-Max | 0.012 A | |
Supply Current-Max | 0.17 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Temperature Grade | MILITARY | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR |