Part Details for SMJ2532-30JM by Texas Instruments
Overview of SMJ2532-30JM by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for SMJ2532-30JM
SMJ2532-30JM CAD Models
SMJ2532-30JM Part Data Attributes
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SMJ2532-30JM
Texas Instruments
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Datasheet
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SMJ2532-30JM
Texas Instruments
IC,EPROM,4KX8,MOS,DIP,24PIN,CERAMIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 300 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-XDIP-T24 | |
Memory Density | 32768 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 4KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Supply Current-Max | 0.16 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for SMJ2532-30JM
This table gives cross-reference parts and alternative options found for SMJ2532-30JM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SMJ2532-30JM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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NMC27C32-30 | National Semiconductor Corporation | Check for Price | IC 4K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | SMJ2532-30JM vs NMC27C32-30 |
NMC27C32H-35 | Texas Instruments | Check for Price | 4KX8 UVPROM, 350ns, CDIP24, WINDOWED, CERAMIC, DIP-24 | SMJ2532-30JM vs NMC27C32H-35 |
NMC27C32-35 | Texas Instruments | Check for Price | 4KX8 UVPROM, 350ns, CDIP24, WINDOWED, CERAMIC, DIP-24 | SMJ2532-30JM vs NMC27C32-35 |
QD2732A-3 | Intel Corporation | Check for Price | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | SMJ2532-30JM vs QD2732A-3 |
AM2732B-300LI | AMD | Check for Price | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | SMJ2532-30JM vs AM2732B-300LI |
NMC27C32-35 | National Semiconductor Corporation | Check for Price | IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | SMJ2532-30JM vs NMC27C32-35 |
AM2732B-305LC | AMD | Check for Price | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | SMJ2532-30JM vs AM2732B-305LC |
NMC27C32H-35 | National Semiconductor Corporation | Check for Price | IC 4K X 8 UVPROM, 350 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | SMJ2532-30JM vs NMC27C32H-35 |
AM2732B-300LE | AMD | Check for Price | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | SMJ2532-30JM vs AM2732B-300LE |
AM2732B-305DC | AMD | Check for Price | UVPROM, 4KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | SMJ2532-30JM vs AM2732B-305DC |