Part Details for SM0-67204FV-30SB by Temic Semiconductors
Overview of SM0-67204FV-30SB by Temic Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Communication and Networking
Robotics and Drones
Part Details for SM0-67204FV-30SB
SM0-67204FV-30SB CAD Models
SM0-67204FV-30SB Part Data Attributes
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SM0-67204FV-30SB
Temic Semiconductors
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Datasheet
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SM0-67204FV-30SB
Temic Semiconductors
FIFO, 4KX9, 30ns, Asynchronous, CMOS, DIE
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TEMIC SEMICONDUCTORS | |
| Package Description | DIE | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 30 ns | |
| Cycle Time | 40 ns | |
| JESD-30 Code | X-XUUC-N | |
| Memory Density | 36864 bit | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX9 | |
| Output Enable | NO | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | UNSPECIFIED | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER |