Part Details for SL2002CC by VIA Technologies Inc
Overview of SL2002CC by VIA Technologies Inc
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- CAD Models: (Request Part)
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for SL2002CC
SL2002CC CAD Models
SL2002CC Part Data Attributes
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SL2002CC
VIA Technologies Inc
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Datasheet
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SL2002CC
VIA Technologies Inc
Network Interface, CMOS, CDIP22
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Rohs Code | No | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | VIA TECHNOLOGIES INC | |
Package Description | DIP, DIP22(UNSPEC) | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
kg CO2e/kg | 12.04 | |
Average Weight (mg) | 3904.25 | |
CO2e (mg) | 47007.17 | |
Category CO2 Kg | 12.04 | |
Compliance Temperature Grade | Commercial: +0C to +70C | |
JESD-30 Code | R-XDIP-T22 | |
JESD-609 Code | e0 | |
Number of Terminals | 22 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP22(UNSPEC) | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |