Part Details for SDASB8Y-256G-1122 by Western Digital Corp
Overview of SDASB8Y-256G-1122 by Western Digital Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| SER2011-122MLB | Coilcraft Inc | General Purpose Inductor, 1.2uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT | |
| SER2011-122MLD | Coilcraft Inc | General Purpose Inductor, 1.2uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT | |
| SER2011-122 | Coilcraft Inc | Power inductor, high current, 10% tol, SMT, RoHS |
Price & Stock for SDASB8Y-256G-1122
| Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | 256GB PC SA530 CLIENT SSD DRIVE RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for SDASB8Y-256G-1122
SDASB8Y-256G-1122 CAD Models
SDASB8Y-256G-1122 Part Data Attributes
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SDASB8Y-256G-1122
Western Digital Corp
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Datasheet
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SDASB8Y-256G-1122
Western Digital Corp
Flash Card, 256GX8,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WESTERN DIGITAL CORP | |
| Package Description | DIE | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-XUUC-N | |
| Memory Density | 2199023255552 bit | |
| Memory IC Type | FLASH CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Words | 274877906944 words | |
| Number of Words Code | 256000000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256GX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | SERIAL | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER |