Part Details for SAK-XE164KM-24F80LAA by Infineon Technologies AG
Overview of SAK-XE164KM-24F80LAA by Infineon Technologies AG
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Part Details for SAK-XE164KM-24F80LAA
SAK-XE164KM-24F80LAA CAD Models
SAK-XE164KM-24F80LAA Part Data Attributes
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SAK-XE164KM-24F80LAA
Infineon Technologies AG
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SAK-XE164KM-24F80LAA
Infineon Technologies AG
Microcontroller, 16-Bit, FLASH, C166SV2 CPU, 80MHz, CMOS, PQFP100,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 16 | |
| Boundary Scan | NO | |
| CPU Family | C166SV2 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 74 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 26624 | |
| ROM (words) | 196608 | |
| ROM Programmability | FLASH | |
| Speed | 80 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |