Part Details for S82S191BF3/883B by NXP Semiconductors
Overview of S82S191BF3/883B by NXP Semiconductors
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S82S191BF3/883B
S82S191BF3/883B CAD Models
S82S191BF3/883B Part Data Attributes:
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S82S191BF3/883B
NXP Semiconductors
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Datasheet
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S82S191BF3/883B
NXP Semiconductors
IC IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC, Programmable ROM
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 16384 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Supply Current-Max | 0.11 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |