Part Details for S72XS256RE0AHBJ10 by Spansion
Overview of S72XS256RE0AHBJ10 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S72XS256RE0AHBJ10
S72XS256RE0AHBJ10 CAD Models
S72XS256RE0AHBJ10 Part Data Attributes
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S72XS256RE0AHBJ10
Spansion
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Datasheet
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S72XS256RE0AHBJ10
Spansion
Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | |
| Pin Count | 133 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.71 | |
| JESD-30 Code | S-PBGA-B133 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+SDRAM | |
| Number of Functions | 1 | |
| Number of Terminals | 133 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA133,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
Alternate Parts for S72XS256RE0AHBJ10
This table gives cross-reference parts and alternative options found for S72XS256RE0AHBJ10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S72XS256RE0AHBJ10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S72XS256RE0AHBHE0 | Memory Circuit | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBHE0 |
| S72XS256RE0AHBHH0 | Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBHH0 |
| S72XS256RE0AHBJ23 | Memory Circuit, 16MX16, CMOS, PBGA133, BGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBJ23 |
| S72XS256RE0AHBJ13 | Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBJ13 |
| S72XS256RE0AHBH10 | SPECIALTY MEMORY CIRCUIT, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBH10 |
| S72XS256RE0AHBJH0 | Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBJH0 |
| S72XS256RE0AHBH20 | Memory Circuit, 16MX16, CMOS, PBGA133, BGA-133 | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBH20 |
| S72XS256RE0AHBHE3 | Memory Circuit | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBHE3 |
| S72XS256RE0AHBHD3 | Memory Circuit | Cypress Semiconductor | S72XS256RE0AHBJ10 vs S72XS256RE0AHBHD3 |
| S72XS256RE0AHBJ20 | Memory Circuit, 16MX16, CMOS, PBGA133, BGA-133 | Infineon Technologies AG | S72XS256RE0AHBJ10 vs S72XS256RE0AHBJ20 |