Part Details for S71WS256ND0BAWE30 by AMD
Overview of S71WS256ND0BAWE30 by AMD
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- Part Data Attributes: (Available)
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Part Details for S71WS256ND0BAWE30
S71WS256ND0BAWE30 CAD Models
S71WS256ND0BAWE30 Part Data Attributes
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S71WS256ND0BAWE30
AMD
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Datasheet
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S71WS256ND0BAWE30
AMD
Memory Circuit, Flash+PSRAM, CMOS, PBGA84
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FBGA, BGA84,10X12,32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 80 ns | |
JESD-30 Code | R-PBGA-B84 | |
Memory IC Type | MEMORY CIRCUIT | |
Mixed Memory Type | FLASH+PSRAM | |
Number of Terminals | 84 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA84,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00004 A | |
Supply Current-Max | 0.066 mA | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |