Part Details for S71PL127JA0BFW9P2 by Spansion
Overview of S71PL127JA0BFW9P2 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S71PL127JA0BFW9P2
S71PL127JA0BFW9P2 CAD Models
S71PL127JA0BFW9P2 Part Data Attributes
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S71PL127JA0BFW9P2
Spansion
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Datasheet
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S71PL127JA0BFW9P2
Spansion
Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 70 ns | |
| Additional Feature | PSRAM IS ORGANIZED AS 1M X 16 | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 11.6 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+PSRAM | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 8MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA64,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |
Alternate Parts for S71PL127JA0BFW9P2
This table gives cross-reference parts and alternative options found for S71PL127JA0BFW9P2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71PL127JA0BFW9P2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S71PL127JA0BAI9Z | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JA0BAI9Z |
| S71PL129JB0BAI9Z3 | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL129JB0BAI9Z3 |
| S71PL127JC0BAI9U2 | Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JC0BAI9U2 |
| S71PL127JB0BFW9Z1 | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, LEAD FREE, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JB0BFW9Z1 |
| S71PL127JB0BAI9B0 | Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JB0BAI9B0 |
| S71PL129JB0BFI9U0 | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL129JB0BFI9U0 |
| S71PL127JA0BAW970 | Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JA0BAW970 |
| S71PL129JB0BAWQB3 | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL129JB0BAWQB3 |
| S71PL127JB0BFW9U3 | Memory Circuit, Flash+PSRAM, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JB0BFW9U3 |
| S71PL127JB0BFW9P1 | Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, LEAD FREE, FBGA-64 | Spansion | S71PL127JA0BFW9P2 vs S71PL127JB0BFW9P1 |