Part Details for S71PL127JA0BFW9P2 by AMD
Overview of S71PL127JA0BFW9P2 by AMD
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- CAD Models: (Request Part)
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S71PL127JA0BFW9P2
S71PL127JA0BFW9P2 CAD Models
S71PL127JA0BFW9P2 Part Data Attributes
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S71PL127JA0BFW9P2
AMD
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Datasheet
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S71PL127JA0BFW9P2
AMD
Memory Circuit, Flash+PSRAM, CMOS, PBGA64,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA, BGA64,10X12,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-PBGA-B64 | |
| Memory IC Type | MEMORY CIRCUIT | |
| Mixed Memory Type | FLASH+PSRAM | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA64,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |