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Overview of S71PL064J08BFW0B2 by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for S71PL064J08BFW0B2 by AMD
Part Data Attributes for S71PL064J08BFW0B2 by AMD
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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ADVANCED MICRO DEVICES INC
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Package Description
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FBGA, BGA56,8X8,32
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.71
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Access Time-Max
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70 ns
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JESD-30 Code
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S-PBGA-B56
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Memory IC Type
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MEMORY CIRCUIT
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Mixed Memory Type
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FLASH+SRAM
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Number of Terminals
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56
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-25 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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FBGA
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Package Equivalence Code
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BGA56,8X8,32
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, FINE PITCH
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Qualification Status
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Not Qualified
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Standby Current-Max
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0.000005 A
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Supply Current-Max
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0.07 mA
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Supply Voltage-Nom (Vsup)
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3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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