Part Details for S71PL064J08BFI0P4 by AMD
Overview of S71PL064J08BFI0P4 by AMD
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Part Details for S71PL064J08BFI0P4
S71PL064J08BFI0P4 CAD Models
S71PL064J08BFI0P4 Part Data Attributes
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S71PL064J08BFI0P4
AMD
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Datasheet
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S71PL064J08BFI0P4
AMD
Memory Circuit, Flash+SRAM, CMOS, PBGA56,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA, BGA56,8X8,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 65 ns | |
| JESD-30 Code | S-PBGA-B56 | |
| Memory IC Type | MEMORY CIRCUIT | |
| Mixed Memory Type | FLASH+SRAM | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA56,8X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.07 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |