Part Details for S71PL064J08BAW0P2 by Spansion
Overview of S71PL064J08BAW0P2 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for S71PL064J08BAW0P2
S71PL064J08BAW0P2 CAD Models
S71PL064J08BAW0P2 Part Data Attributes
|
S71PL064J08BAW0P2
Spansion
Buy Now
Datasheet
|
Compare Parts:
S71PL064J08BAW0P2
Spansion
Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 56 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | STATIC RAM IS ORGANIZED AS 512K X 16 | |
JESD-30 Code | R-PBGA-B56 | |
JESD-609 Code | e0 | |
Length | 9 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 56 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 4MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm |
Alternate Parts for S71PL064J08BAW0P2
This table gives cross-reference parts and alternative options found for S71PL064J08BAW0P2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71PL064J08BAW0P2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
S71PL064J08BAI0P3 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BAI0P3 |
S71PL064J08BFW0P3 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BFW0P3 |
S71PL064J08BAW0P4 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BAW0P4 |
S71PL064J08BFW0P2 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BFW0P2 |
S71PL064J08BAI0P0 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BAI0P0 |
S71PL064J08BFI0P4 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BFI0P4 |
S71PL064J08BFI0P3 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BFI0P3 |
S71PL064J08BAW0P3 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BAW0P3 |
S71PL064J08BFI0P0 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BFI0P0 |
S71PL064J08BAI0P2 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, FBGA-56 | Spansion | S71PL064J08BAW0P2 vs S71PL064J08BAI0P2 |