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Overview of S71PL032J04BAW0F3 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for S71PL032J04BAW0F3 by Cypress Semiconductor
Part Data Attributes for S71PL032J04BAW0F3 by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Reach Compliance Code
|
compliant
|
Access Time-Max
|
70 ns
|
JESD-30 Code
|
S-PBGA-B56
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Memory IC Type
|
MEMORY CIRCUIT
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Mixed Memory Type
|
FLASH+SRAM
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Number of Terminals
|
56
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-25 °C
|
Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
FBGA
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Package Equivalence Code
|
BGA56,8X8,32
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Package Shape
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SQUARE
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Package Style
|
GRID ARRAY, FINE PITCH
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Power Supplies
|
3 V
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Qualification Status
|
Not Qualified
|
Standby Current-Max
|
0.000005 A
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Supply Current-Max
|
0.07 mA
|
Supply Voltage-Nom (Vsup)
|
3 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
OTHER
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Terminal Form
|
BALL
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Terminal Pitch
|
0.8 mm
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Terminal Position
|
BOTTOM
|