Part Details for S29GL256S10FHI023 by Cypress Semiconductor
Overview of S29GL256S10FHI023 by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S29GL256S10FHI023
S29GL256S10FHI023 CAD Models
S29GL256S10FHI023 Part Data Attributes
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S29GL256S10FHI023
Cypress Semiconductor
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Datasheet
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S29GL256S10FHI023
Cypress Semiconductor
EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-64 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 100 ns | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | EEPROM CARD | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 256 | |
| Number of Terminals | 64 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Page Size | 16 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.4 mm | |
| Sector Size | 64K | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 11 mm | |
| Write Cycle Time-Max (tWC) | 0.00006 ms |
Alternate Parts for S29GL256S10FHI023
This table gives cross-reference parts and alternative options found for S29GL256S10FHI023. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL256S10FHI023, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| S29GL256S10DHIV20 | Cypress Semiconductor | Check for Price | Flash, 32MX8, 100ns, PBGA64, PACKAGE | S29GL256S10FHI023 vs S29GL256S10DHIV20 |
| S29GL256S10FHIV20 | Cypress Semiconductor | Check for Price | Flash, 16MX16, 100ns, PBGA64, FBGA-64 | S29GL256S10FHI023 vs S29GL256S10FHIV20 |
| S29GL256S10DHIV10 | Spansion | Check for Price | Flash, 32MX8, 100ns, PBGA64, LEAD FREE, PACKAGE | S29GL256S10FHI023 vs S29GL256S10DHIV10 |
| S29GL256S10FHIV10 | Spansion | Check for Price | Flash, 32MX8, 100ns, PBGA64, LEAD FREE, PACKAGE | S29GL256S10FHI023 vs S29GL256S10FHIV10 |
| S29GL256S10DHI020 | Spansion | Check for Price | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | S29GL256S10FHI023 vs S29GL256S10DHI020 |
| S29GL256S10FHIV23 | Spansion | Check for Price | EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64 | S29GL256S10FHI023 vs S29GL256S10FHIV23 |