Part Details for S29GL01GT10FHI010 by Cypress Semiconductor
Overview of S29GL01GT10FHI010 by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL01GT10FHI010
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
22AC8617
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Newark | Flash Memory, 1Gbit, Fbga-64, Flash Memory Type:Parallel Nor, Memory Size:1Gbit, Flash Memory Configuration:128M X 8Bit, Ic Interface Type:Cfi, Parallel, Memory Case Style:Fbga, No. Of Pins:64Pins, Clock Frequency:-, Access Rohs Compliant: Yes |Cypress Infineon Technologies S29GL01GT10FHI010 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 1592 |
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$11.5200 / $15.3000 | Buy Now |
DISTI #
2832-S29GL01GT10FHI010-ND
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DigiKey | FLASH - NOR MEMORY IC 1GB (128M Min Qty: 60 Lead time: 1 Weeks Container: Tray MARKETPLACE PRODUCT |
11127 In Stock |
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$11.1400 | Buy Now |
|
LCSC | 1Gbit Parallel Port LBGA-64 NOR FLASH ROHS | 3 |
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$16.6675 / $17.2203 | Buy Now |
Part Details for S29GL01GT10FHI010
S29GL01GT10FHI010 CAD Models
S29GL01GT10FHI010 Part Data Attributes
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S29GL01GT10FHI010
Cypress Semiconductor
Buy Now
Datasheet
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S29GL01GT10FHI010
Cypress Semiconductor
Flash, 64MX16, 100ns, PBGA64, FBGA-64
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Total Weight | 263.42 | |
Category CO2 Kg | 12 | |
CO2 | 3161.04 | |
Compliance Temperature Grade | Industrial: -40C to +85C | |
EU RoHS Version | RoHS 2 (2015/863/EU) | |
Candidate List Date | 2021-07-08 | |
CAS Accounted for Wt | 83 | |
CA Prop 65 Presence | YES | |
CA Prop 65 CAS Numbers | 1333-86-4, 7440-02-0 | |
EFUP | e | |
Conflict Mineral Status | DRC Conflict Free | |
Conflict Mineral Status Source | CMRT V5.10 | |
Access Time-Max | 100 ns | |
Boot Block | BOTTOM/TOP | |
JESD-30 Code | R-PBGA-B64 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 64 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 2.7 V | |
Seated Height-Max | 1.4 mm | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Type | NOR TYPE | |
Width | 11 mm |