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Overview of S29GL01GP12TFIR10 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for S29GL01GP12TFIR10 by Spansion
Part Data Attributes for S29GL01GP12TFIR10 by Spansion
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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SPANSION INC
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Part Package Code
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TSOP1
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Package Description
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HTSSOP,
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Pin Count
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56
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.51
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Access Time-Max
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120 ns
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JESD-30 Code
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R-PDSO-G56
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Length
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18.4 mm
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Memory Density
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1073741824 bit
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Memory IC Type
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FLASH
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Memory Width
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1
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Number of Functions
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1
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Number of Terminals
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56
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Number of Words
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1073741824 words
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Number of Words Code
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1000000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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1GX1
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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HTSSOP
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
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Parallel/Serial
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PARALLEL
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Programming Voltage
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3 V
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.2 mm
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Supply Voltage-Max (Vsup)
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3.6 V
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Supply Voltage-Min (Vsup)
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3 V
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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GULL WING
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Terminal Pitch
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0.5 mm
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Terminal Position
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DUAL
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Type
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NOR TYPE
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Width
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14 mm
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