Part Details for RHDSP24-Y-75-M by DSP Architectures Inc
Overview of RHDSP24-Y-75-M by DSP Architectures Inc
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Part Details for RHDSP24-Y-75-M
RHDSP24-Y-75-M CAD Models
RHDSP24-Y-75-M Part Data Attributes:
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RHDSP24-Y-75-M
DSP Architectures Inc
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RHDSP24-Y-75-M
DSP Architectures Inc
Digital Signal Processor, 24-Bit Size, CBGA472
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | DSP ARCHITECTURES INC | |
| Package Description | BGA, BGA472,22X22,50 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 24 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-XBGA-B472 | |
| Number of Terminals | 472 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA472,22X22,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM |