Part Details for RD28F1602C3B70 by Intel Corporation
Overview of RD28F1602C3B70 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for RD28F1602C3B70
RD28F1602C3B70 CAD Models
RD28F1602C3B70 Part Data Attributes:
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RD28F1602C3B70
Intel Corporation
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Datasheet
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RD28F1602C3B70
Intel Corporation
Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA66,8X12,32 | |
| Pin Count | 66 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 70 ns | |
| Additional Feature | SRAM IS ORGANIZED AS 256K X 16 | |
| JESD-30 Code | R-PBGA-B66 | |
| Length | 10 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+SRAM | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA66,8X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.000004 A | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm |
Alternate Parts for RD28F1602C3B70
This table gives cross-reference parts and alternative options found for RD28F1602C3B70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RD28F1602C3B70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M36W216BI70ZA1 | Memory Circuit, 1MX16, CMOS, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | Numonyx Memory Solutions | RD28F1602C3B70 vs M36W216BI70ZA1 |
| RD38F1020C0ZBL0 | Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA66, 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66 | Intel Corporation | RD28F1602C3B70 vs RD38F1020C0ZBL0 |
| M36W216TI85ZA1 | Memory Circuit, 1MX16, CMOS, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | Numonyx Memory Solutions | RD28F1602C3B70 vs M36W216TI85ZA1 |
| M36W416BG70ZA1 | Memory Circuit, 1MX16, CMOS, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | Numonyx Memory Solutions | RD28F1602C3B70 vs M36W416BG70ZA1 |
| M36W432BG85ZA6T | SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | STMicroelectronics | RD28F1602C3B70 vs M36W432BG85ZA6T |
| AT52BR1662-70CI | Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA66, 10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-66 | Atmel Corporation | RD28F1602C3B70 vs AT52BR1662-70CI |
| M36W432B85ZA6T | SPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | STMicroelectronics | RD28F1602C3B70 vs M36W432B85ZA6T |
| AT52BR1664A-70CI | Memory Circuit, 1MX16, CMOS, PBGA66 | Microchip Technology Inc | RD28F1602C3B70 vs AT52BR1664A-70CI |
| M36W216BI70ZA6T | SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | STMicroelectronics | RD28F1602C3B70 vs M36W216BI70ZA6T |
| M36W216BI70ZA1T | SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | STMicroelectronics | RD28F1602C3B70 vs M36W216BI70ZA1T |