There are no models available for this part yet.
Overview of R1EX25016ATA00A by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| R1EX25016ATA00A#S0 | Renesas Electronics Corporation | EEPROM, TSSOP, / |
CAD Models for R1EX25016ATA00A by Renesas Electronics Corporation
Part Data Attributes for R1EX25016ATA00A by Renesas Electronics Corporation
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
|
|
Part Package Code
|
SOIC
|
|
Package Description
|
TSSOP, TSSOP8,.25
|
|
Pin Count
|
8
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Clock Frequency-Max (fCLK)
|
5 MHz
|
|
Data Retention Time-Min
|
100
|
|
Endurance
|
1000000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-PDSO-G8
|
|
Length
|
4.4 mm
|
|
Memory Density
|
16384 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
8
|
|
Number of Words
|
2048 words
|
|
Number of Words Code
|
2000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
2KX8
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSSOP
|
|
Package Equivalence Code
|
TSSOP8,.25
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Parallel/Serial
|
SERIAL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.1 mm
|
|
Serial Bus Type
|
SPI
|
|
Supply Current-Max
|
0.003 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
1.8 V
|
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.65 mm
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
3 mm
|
|
Write Cycle Time-Max (tWC)
|
5 ms
|
|
Write Protection
|
HARDWARE/SOFTWARE
|