Part Details for QD2147HL by Intel Corporation
Overview of QD2147HL by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
Part Details for QD2147HL
QD2147HL CAD Models
QD2147HL Part Data Attributes
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QD2147HL
Intel Corporation
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Datasheet
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QD2147HL
Intel Corporation
Standard SRAM, 4KX1, 70ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP18,.3 | |
| Pin Count | 18 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| Additional Feature | AUTOMATIC POWER-DOWN | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-GDIP-T18 | |
| JESD-609 Code | e0 | |
| Length | 22.86 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX1 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for QD2147HL
This table gives cross-reference parts and alternative options found for QD2147HL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD2147HL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC2147HJ | Standard SRAM, 4KX1, 70ns, NMOS, CDIP18, CERAMIC, DIP-18 | Rochester Electronics LLC | QD2147HL vs NMC2147HJ |
| AM2147-70DCB | Standard SRAM, 4KX1, 70ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | QD2147HL vs AM2147-70DCB |
| M38510/23803BVA | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, CERAMIC, DIP-18 | Rochester Electronics LLC | QD2147HL vs M38510/23803BVA |
| AM9147-70PC | Standard SRAM, 4KX1, 70ns, MOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | AMD | QD2147HL vs AM9147-70PC |
| AM2147-70DEB | Standard SRAM, 4KX1, 70ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | QD2147HL vs AM2147-70DEB |
| AM2147-70DM | Standard SRAM | Rochester Electronics LLC | QD2147HL vs AM2147-70DM |
| NMC2147HJ | 4KX1 STANDARD SRAM, 70ns, CDIP18, CERAMIC, DIP-18 | Texas Instruments | QD2147HL vs NMC2147HJ |
| M38510/23803BVA | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, CERAMIC, DIP-18 | Intel Corporation | QD2147HL vs M38510/23803BVA |
| M38510/23803BVX | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, CERAMIC, DIP-18 | Rochester Electronics LLC | QD2147HL vs M38510/23803BVX |
| M38510/23803BVX | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, CERAMIC, DIP-18 | Intel Corporation | QD2147HL vs M38510/23803BVX |