There are no models available for this part yet.
Overview of PQ52B33-350 by LSI Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for PQ52B33-350 by LSI Corporation
Part Data Attributes for PQ52B33-350 by LSI Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SEEQ TECHNOLOGY INC
|
Package Description
|
DIP, DIP28,.6
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Access Time-Max
|
350 ns
|
Additional Feature
|
10000 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS
|
Command User Interface
|
NO
|
Data Polling
|
NO
|
Data Retention Time-Min
|
10
|
JESD-30 Code
|
R-PDIP-T28
|
JESD-609 Code
|
e0
|
Memory Density
|
65536 bit
|
Memory IC Type
|
EEPROM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
8192 words
|
Number of Words Code
|
8000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
8KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.6
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
5 V
|
Qualification Status
|
Not Qualified
|
Standby Current-Max
|
0.04 A
|
Supply Current-Max
|
0.11 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
MOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Toggle Bit
|
NO
|
Alternate Parts for PQ52B33-350
This table gives cross-reference parts and alternative options found for PQ52B33-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PQ52B33-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
P5C164X350CWMB | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | PQ52B33-350 vs P5C164X350CWMB |
AT28PC64E-35DM/883 | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Atmel Corporation | PQ52B33-350 vs AT28PC64E-35DM/883 |
X2864ADI-35 | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 | Xicor Inc | PQ52B33-350 vs X2864ADI-35 |
AM2864BE-355DCB | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM2864BE-355DCB |
AM9864-35DE | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM9864-35DE |
AM2864B-355DC | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM2864B-355DC |
AM9864-3DC | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM9864-3DC |
AM2864B-35DEB | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM2864B-35DEB |
5962-8751418XX | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Atmel Corporation | PQ52B33-350 vs 5962-8751418XX |
AM2864BE-355DC | EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | AMD | PQ52B33-350 vs AM2864BE-355DC |