PQ52B33-350
LSI Corporation
Description: EEPROM, 8KX8, 350ns, Parallel, MOS, PDIP28

Overview of PQ52B33-350 by LSI Corporation

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Part Data Attributes for PQ52B33-350 by LSI Corporation

PQ52B33-350
LSI Corporation
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
Package Description
DIP, DIP28,.6
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
350 ns
Additional Feature
10000 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS
Command User Interface
NO
Data Polling
NO
Data Retention Time-Min
10
JESD-30 Code
R-PDIP-T28
JESD-609 Code
e0
Memory Density
65536 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Standby Current-Max
0.04 A
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
MOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Toggle Bit
NO
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  1. PQ52B33-350
    LSI Corporation
    EEPROM, 8KX8, 350ns, Parallel, MOS, PDIP28
    VS

Alternate Parts for PQ52B33-350

This table gives cross-reference parts and alternative options found for PQ52B33-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PQ52B33-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
P5C164X350CWMB EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 Pyramid Semiconductor Corporation PQ52B33-350 vs P5C164X350CWMB
AT28PC64E-35DM/883 EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation PQ52B33-350 vs AT28PC64E-35DM/883
X2864ADI-35 EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc PQ52B33-350 vs X2864ADI-35
AM2864BE-355DCB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864BE-355DCB
AM9864-35DE EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM9864-35DE
AM2864B-355DC EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864B-355DC
AM9864-3DC EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM9864-3DC
AM2864B-35DEB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864B-35DEB
5962-8751418XX EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation PQ52B33-350 vs 5962-8751418XX
AM2864BE-355DC EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864BE-355DC
Part Number Description Manufacturer Compare
AM2864BE-350DE EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864BE-350DE
PYA28C64XE-35CWM EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation PQ52B33-350 vs PYA28C64XE-35CWM
XLE2864A-350P EEPROM, 8KX8, 350ns, Parallel, NMOS, PDIP28, Exel Microelectronics Inc PQ52B33-350 vs XLE2864A-350P
AM2864A-355DIB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864A-355DIB
AM2864B-35DCB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864B-35DCB
AM2864AE-350DC EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864AE-350DC
DE2864-350 EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28 LSI Corporation PQ52B33-350 vs DE2864-350
DM28C65-350 EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28 LSI Corporation PQ52B33-350 vs DM28C65-350
AM2864BE-350DEB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864BE-350DEB
AM2864AE-350DIB EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 AMD PQ52B33-350 vs AM2864AE-350DIB

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