Part Details for PNX8526EH/M0 by NXP Semiconductors
Overview of PNX8526EH/M0 by NXP Semiconductors
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Part Details for PNX8526EH/M0
PNX8526EH/M0 CAD Models
PNX8526EH/M0 Part Data Attributes
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PNX8526EH/M0
NXP Semiconductors
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Datasheet
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PNX8526EH/M0
NXP Semiconductors
IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 35 X 35 MM, 1.8 MM HEIGHT, PLASTIC, MS-034, SOT610-1, HBGA-456, Consumer IC:Other
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | HBGA, BGA456,26X26,50 | |
| Pin Count | 456 | |
| Manufacturer Package Code | SOT-610-1 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | S-PBGA-B456 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Current-Max | 200 mA | |
| Supply Voltage-Max (Vsup) | 1.32 V | |
| Supply Voltage-Min (Vsup) | 1.26 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |