Datasheets
PM6104B-FEI by: Microchip Technology Inc

Support Circuit, PBGA1221

Part Details for PM6104B-FEI by Microchip Technology Inc

Results Overview of PM6104B-FEI by Microchip Technology Inc

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

PM6104B-FEI Information

PM6104B-FEI by Microchip Technology Inc is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for PM6104B-FEI

Part # Distributor Description Stock Price Buy
DISTI # 09AJ3638
Newark Meta-Dx1: 1.2T Ethernet Mac/Phy Retimer/Gearbox/Crosspoint 1221 Bbga 29X29X3.57Mm Tray Rohs Complian... t: Yes |Microchip PM6104B-FEI more RoHS: Compliant Min Qty: 36 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $531.8300
  • 100 $481.7700
$481.7700 / $531.8300 Buy Now
DISTI # 150-PM6104B-FEI-ND
DigiKey META-DX1: 1.2T ETHERNET Min Qty: 1 Lead time: 22 Weeks Container: Tray 9
In Stock
  • 1 $639.8500
$639.8500 Buy Now
DISTI # PM6104B-FEI
Avnet Americas PM6104B-FEI - Trays (Alt: PM6104B-FEI) RoHS: Not Compliant Min Qty: 36 Package Multiple: 36 Lead time: 22 Weeks, 0 Days Container: Tray 0
  • 36 $558.9675
  • 72 $546.6825
  • 144 $495.4628
  • 216 $487.2680
  • 288 $479.1155
$479.1155 / $558.9675 Buy Now
DISTI # 579-PM6104B-FEI
Mouser Electronics Ethernet ICs META-DX1: 1.2T Ethernet MAC/PHY Retimer/Gearbox/Crosspoint RoHS: Compliant 31
  • 1 $639.8500
$639.8500 Buy Now
DISTI # PM6104B-FEI
Microchip Technology Inc META-DX1: 1.2T Ethernet MAC/PHY Retimer/Gearbox/Crosspoint, BBGA, Projected EOL: 2044-10-29 RoHS: Compliant Lead time: 22 Weeks, 0 Days Container: Tray 0

Alternates Available

COO: Taiwan
  • 1 $639.8500
  • 25 $531.8300
  • 100 $481.7700
$481.7700 / $639.8500 Buy Now
Future Electronics   RoHS: Not Compliant pbFree: No Min Qty: 36 Package Multiple: 36 0
  • 36 $546.0000
$546.0000 Buy Now
Onlinecomponents.com   RoHS: Compliant 0
  • 9 $1,523.3400
  • 18 $778.0500
  • 27 $529.6200
  • 36 $519.0300
$519.0300 / $1,523.3400 Buy Now
NAC   RoHS: Compliant Min Qty: 36 Package Multiple: 36 0
  • 1 $546.0000
  • 11 $525.0000
  • 20 $511.8800
$511.8800 / $546.0000 Buy Now
DISTI # PM6104B-FEI
Avnet Silica PM6104BFEI (Alt: PM6104B-FEI) RoHS: Compliant Min Qty: 36 Package Multiple: 36 Lead time: 24 Weeks, 0 Days Silica - 0
Buy Now
DISTI # PM6104B-FEI
EBV Elektronik PM6104BFEI (Alt: PM6104B-FEI) RoHS: Compliant Min Qty: 36 Package Multiple: 36 Lead time: 23 Weeks, 0 Days EBV - 0
Buy Now
Master Electronics   RoHS: Compliant 0
  • 9 $1,523.3400
  • 18 $778.0500
  • 27 $529.6200
  • 36 $519.0300
$519.0300 / $1,523.3400 Buy Now

Part Details for PM6104B-FEI

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PM6104B-FEI Part Data Attributes

PM6104B-FEI Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
PM6104B-FEI Microchip Technology Inc Support Circuit, PBGA1221
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description BBGA-1221
Reach Compliance Code compliant
Factory Lead Time 22 Weeks
Samacsys Manufacturer Microchip
Data Rate 1200000000 Mbps
JESD-30 Code S-PBGA-B1221
Number of Functions 1
Number of Terminals 1221
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Telecom IC Type SUPPORT CIRCUIT
Terminal Form BALL
Terminal Position BOTTOM

PM6104B-FEI Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.

  • Implement a robust thermal management system, ensure proper PCB layout, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer.

  • Use a shielded enclosure, ensure proper PCB layout, and follow good electromagnetic compatibility (EMC) design practices. Implement filtering and shielding to minimize emissions and susceptibility.

  • Use the device's power-saving features, such as the low-power mode, and optimize the system's power management. Implement power gating, and consider using a low-dropout regulator (LDO) to reduce power consumption.

  • Follow the recommended test procedures outlined in the datasheet, and use a calibrated test setup to ensure accurate measurements. Use a high-impedance probe to minimize loading effects.