Part Details for PM3393 by Microsemi Corporation
Overview of PM3393 by Microsemi Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Energy and Power Systems
Healthcare
Transportation and Logistics
Renewable Energy
Telecommunications
Automotive
Part Details for PM3393
PM3393 CAD Models
PM3393 Part Data Attributes
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PM3393
Microsemi Corporation
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Datasheet
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PM3393
Microsemi Corporation
Telecom IC, CMOS, PBGA672
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B672 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |