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Microcontrollers and Processors / Microprocessors / PCX755VG350LE
Datasheets
PCX755VG350LE by: Teledyne e2v

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360

Part Details for PCX755VG350LE by Teledyne e2v

Overview of PCX755VG350LE by Teledyne e2v

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Part Details for PCX755VG350LE

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PCX755VG350LE Part Data Attributes

Parametric Data
PCX755VG350LE Teledyne e2v
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PCX755VG350LE Teledyne e2v RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PCX755VG350LE

This table gives cross-reference parts and alternative options found for PCX755VG350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755VG350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
PC755VGH350LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 PCX755VG350LE vs PC755VGH350LE
IBM25PPC750L-EB0B350W IBM Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 PCX755VG350LE vs IBM25PPC750L-EB0B350W
XPC755BRX350TE Freescale Semiconductor Check for Price 32-BIT, 350MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 PCX755VG350LE vs XPC755BRX350TE
PC755BVZFU350LD Thales Group Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 PCX755VG350LE vs PC755BVZFU350LD
XPC755BRX350LD Freescale Semiconductor Check for Price IC,MICROPROCESSOR,64-BIT,CMOS,BGA,360PIN,CERAMIC PCX755VG350LE vs XPC755BRX350LD
PC755CMGHU350LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 PCX755VG350LE vs PC755CMGHU350LE
PC755VG350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 PCX755VG350LE vs PC755VG350LE
PCX755BMZFU350LE Thales Group Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 PCX755VG350LE vs PCX755BMZFU350LE
PC755MGU350LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 PCX755VG350LE vs PC755MGU350LE
PCX755VZF350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 PCX755VG350LE vs PCX755VZF350LE
Part Number Manufacturer Composite Price Description Compare
PCX755MGU350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 PCX755VG350LE vs PCX755MGU350LE
PCX755BVZFU350LD Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 PCX755VG350LE vs PCX755BVZFU350LD
PC755VGS366LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 PCX755VG350LE vs PC755VGS366LE
PC755MGSU366LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 PCX755VG350LE vs PC755MGSU366LE
XPC755BRX350LB Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 PCX755VG350LE vs XPC755BRX350LB
PC755VGHU350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 PCX755VG350LE vs PC755VGHU350LE
PC755BMGS350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 PCX755VG350LE vs PC755BMGS350LE
IBM25EMPPC750LCBC3660 IBM Check for Price RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 PCX755VG350LE vs IBM25EMPPC750LCBC3660
PCX755BMZF350LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 PCX755VG350LE vs PCX755BMZF350LE
IBM25PPC750L-GB350A2T IBM Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 PCX755VG350LE vs IBM25PPC750L-GB350A2T

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