Part Details for PC755VGS366LE by Atmel Corporation
Overview of PC755VGS366LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Industrial Automation
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Electronic Manufacturing
Part Details for PC755VGS366LE
PC755VGS366LE CAD Models
PC755VGS366LE Part Data Attributes
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PC755VGS366LE
Atmel Corporation
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Datasheet
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PC755VGS366LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | CGA | |
| Package Description | CGA, BGA360,19X19,50 | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-C360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 366 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | C BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755VGS366LE
This table gives cross-reference parts and alternative options found for PC755VGS366LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755VGS366LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PC755VGSU366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | PC755VGS366LE vs PC755VGSU366LE |
| PC755MGSU366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | PC755VGS366LE vs PC755MGSU366LE |
| PC755VGS366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | PC755VGS366LE vs PC755VGS366LE |
| PC755MGS366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | PC755VGS366LE vs PC755MGS366LE |
| PC755VGSU366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | PC755VGS366LE vs PC755VGSU366LE |