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Microcontrollers and Processors / Microprocessors / PC755BVZFU300LE
Datasheets
PC755BVZFU300LE by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Part Details for PC755BVZFU300LE by Teledyne e2v

Overview of PC755BVZFU300LE by Teledyne e2v

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BVZFU300LE

PC755BVZFU300LE CAD Models

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PC755BVZFU300LE Part Data Attributes

Parametric Data
PC755BVZFU300LE Teledyne e2v
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PC755BVZFU300LE Teledyne e2v RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.77 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BVZFU300LE

This table gives cross-reference parts and alternative options found for PC755BVZFU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BVZFU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BVZFU300LE vs PC755BMZFU300LD
PC755CVGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BVZFU300LE vs PC755CVGSU300LE
PCX755BMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755BVZFU300LE vs PCX755BMZFU300LE
PCX755VGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BVZFU300LE vs PCX755VGU300LE
IBM25PPC750L-GB300A2R RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BVZFU300LE vs IBM25PPC750L-GB300A2R
PC755CMGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BVZFU300LE vs PC755CMGHU300LE
PC755VZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BVZFU300LE vs PC755VZFU300LE
PCX755BMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BVZFU300LE vs PCX755BMZFU300LE
XPC755BRX300LD IC,MICROPROCESSOR,64-BIT,CMOS,BGA,360PIN,CERAMIC Freescale Semiconductor PC755BVZFU300LE vs XPC755BRX300LD
MPC755BPX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BVZFU300LE vs MPC755BPX300LE
Part Number Description Manufacturer Compare
MPC755BRX300LX 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BVZFU300LE vs MPC755BRX300LX
PC755CMGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BVZFU300LE vs PC755CMGSU300LE
XPC755BRX300LB 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BVZFU300LE vs XPC755BRX300LB
IBM25PPC750L-EB0B300W RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BVZFU300LE vs IBM25PPC750L-EB0B300W
XPC755BRX300LB RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PC755BVZFU300LE vs XPC755BRX300LB
PC755MGS300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755BVZFU300LE vs PC755MGS300LE
PC755MZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BVZFU300LE vs PC755MZFU300LE
XPC755BPX300LE IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC Freescale Semiconductor PC755BVZFU300LE vs XPC755BPX300LE
PC755VG300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BVZFU300LE vs PC755VG300LE
MPC755BVT300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BVZFU300LE vs MPC755BVT300LE

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