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Microcontrollers and Processors / Microprocessors / PC755BMZFU350LE
Datasheets
PC755BMZFU350LE by:

RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Part Details for PC755BMZFU350LE by Teledyne e2v

Overview of PC755BMZFU350LE by Teledyne e2v

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMZFU350LE

PC755BMZFU350LE CAD Models

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PC755BMZFU350LE Part Data Attributes

Parametric Data
PC755BMZFU350LE Teledyne e2v
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PC755BMZFU350LE Teledyne e2v RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.77 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMZFU350LE

This table gives cross-reference parts and alternative options found for PC755BMZFU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZFU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755BMZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755BMZFU350LE vs PC755BMZFU350LE
PCX755VG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755VG350LE
PCX755MZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755MZF350LE
PCX755VGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755VGH350LE
PC755CVZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP-CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PC755CVZFU350LE
XPC755BPX350LE 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 Motorola Mobility LLC PC755BMZFU350LE vs XPC755BPX350LE
PCX755BVZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755BVZFU350LE
PCX755BVZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PCX755BVZFU350LE
IBM25PPC750L-EB0C350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25PPC750L-EB0C350W
PCX755MGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755MGU350LE
Part Number Description Manufacturer Compare
PC755CVGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BMZFU350LE vs PC755CVGU350LE
MPC755BPX350LE 32-BIT, 350MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU350LE vs MPC755BPX350LE
MPC755BRX350LX 32-BIT, 350MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BMZFU350LE vs MPC755BRX350LX
MPC755BPX350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU350LE vs MPC755BPX350
PC755BMGH366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, HITCE-360 Teledyne e2v PC755BMZFU350LE vs PC755BMGH366LE
MPC7400RX350TX RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PC755BMZFU350LE vs MPC7400RX350TX
PCX755MZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU350LE vs PCX755MZF350LE
PC755BVZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, FCBGA-360 Teledyne e2v PC755BMZFU350LE vs PC755BVZF350LE
IBM25PPC750L-GB366A2T RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25PPC750L-GB366A2T
PC755MZF366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PC755MZF366LE

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