Memory
P5C164X300L32MB
Pyramid Semiconductor Corporation
Description: EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

Overview of P5C164X300L32MB by Pyramid Semiconductor Corporation

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Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

CAD Models for P5C164X300L32MB by Pyramid Semiconductor Corporation
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Part Data Attributes for P5C164X300L32MB by Pyramid Semiconductor Corporation

P5C164X300L32MB
Pyramid Semiconductor Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
Part Package Code
QFJ
Package Description
0.450 X 0.550 INCH, CERAMIC, LCC-32
Pin Count
32
Reach Compliance Code
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Access Time-Max
300 ns
JESD-30 Code
R-CQCC-N32
JESD-609 Code
e0
Length
13.97 mm
Memory Density
65536 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
1.905 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Width
11.43 mm
Want to compare parts?
  1. P5C164X300L32MB
    Pyramid Semiconductor Corporation
    EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32
    VS

Alternate Parts for P5C164X300L32MB

This table gives cross-reference parts and alternative options found for P5C164X300L32MB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P5C164X300L32MB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM2864BE-300LIB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864BE-300LIB
X28C64ET1 EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc P5C164X300L32MB vs X28C64ET1
P5C164300L32MB EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation P5C164X300L32MB vs P5C164300L32MB
X2864AE EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc P5C164X300L32MB vs X2864AE
AM2864A-30LCB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LCB
AM2864A-30LEB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LEB
AM2864A-30LI EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LI
AM2864AE-300LC EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864AE-300LC
AM2864B-30LE EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864B-30LE
AM2864A-3LCB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-3LCB
Part Number Description Manufacturer Compare
AM2864BE-305LEB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864BE-305LEB
AM2864AE-300LEB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864AE-300LEB
AM2864AE-300LI EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864AE-300LI
AM2864A-30LCB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LCB
X28C64G EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc P5C164X300L32MB vs X28C64G
AM2864A-30LC EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LC
AM9864-30/BUC EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM9864-30/BUC
P5C164300L32M EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation P5C164X300L32MB vs P5C164300L32M
AM2864A-30LIB EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-30LIB
AM2864A-3LE EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD P5C164X300L32MB vs AM2864A-3LE

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