Memory
P4C164L-70L32MB
Pyramid Semiconductor Corporation
Description: Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

Overview of P4C164L-70L32MB by Pyramid Semiconductor Corporation

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Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

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Part Data Attributes for P4C164L-70L32MB by Pyramid Semiconductor Corporation

P4C164L-70L32MB
Pyramid Semiconductor Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
Part Package Code
QFJ
Package Description
0.450 X 0.550 INCH, CERAMIC, LCC-32
Pin Count
32
Reach Compliance Code
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
70 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
JESD-609 Code
e0
Length
13.97 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
1.905 mm
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.145 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Width
11.43 mm
Want to compare parts?
  1. P4C164L-70L32MB
    Pyramid Semiconductor Corporation
    Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32
    VS

Alternate Parts for P4C164L-70L32MB

This table gives cross-reference parts and alternative options found for P4C164L-70L32MB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164L-70L32MB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
P4C164L-70DWMLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164L-70DWMLF
FT6264L-70DWMB Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd P4C164L-70L32MB vs FT6264L-70DWMB
5962-8552511XX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, Electronic Designs Inc P4C164L-70L32MB vs 5962-8552511XX
P4C164-70CWMBLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164-70CWMBLF
5962-3829407MXA 8KX8 STANDARD SRAM, 70ns, CDIP28, CERAMIC, DIP-28 Motorola Mobility LLC P4C164L-70L32MB vs 5962-3829407MXA
P4C164L-70CWI Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164L-70CWI
FT6264L-70P6C Standard SRAM Force Technologies Ltd P4C164L-70L32MB vs FT6264L-70P6C
FT6164L-70L32MLF Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32 Force Technologies Ltd P4C164L-70L32MB vs FT6164L-70L32MLF
P4C164-70CWI Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164-70CWI
5962-3829448MZX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components P4C164L-70L32MB vs 5962-3829448MZX
Part Number Description Manufacturer Compare
AS5C4008CW-45/IT Standard SRAM, 512KX8, 45ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components P4C164L-70L32MB vs AS5C4008CW-45/IT
5962-9559506HAX SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components P4C164L-70L32MB vs 5962-9559506HAX
AS8S128K32QT-45/IT SRAM Module, 128KX32, 45ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 Micross Components P4C164L-70L32MB vs AS8S128K32QT-45/IT
P4C164-100DWC Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164-100DWC
P4C164L-100CWMB Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164L-70L32MB vs P4C164L-100CWMB
MT5C2568EC-25/IT Standard SRAM, 32KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28 Micross Components P4C164L-70L32MB vs MT5C2568EC-25/IT
5962-8855206TA Standard SRAM, 32KX8, 25ns, CMOS, CDFP28, CERAMIC, DFP-28 Micross Components P4C164L-70L32MB vs 5962-8855206TA
5962-9315603HYA Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32, DUAL CAVITY, BOTTOM BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 White Microelectronics P4C164L-70L32MB vs 5962-9315603HYA
5962-9461110HAX SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp P4C164L-70L32MB vs 5962-9461110HAX
5962-9461116HAA SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp P4C164L-70L32MB vs 5962-9461116HAA

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