Datasheets
P4C164-70DWM by: Pyramid Semiconductor Corporation

Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Part Details for P4C164-70DWM by Pyramid Semiconductor Corporation

Overview of P4C164-70DWM by Pyramid Semiconductor Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for P4C164-70DWM

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P4C164-70DWM Part Data Attributes

P4C164-70DWM Pyramid Semiconductor Corporation
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P4C164-70DWM Pyramid Semiconductor Corporation Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 70 ns
Additional Feature LG-MAX
I/O Type COMMON
JESD-30 Code R-CDIP-T28
JESD-609 Code e0
Length 37.846 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for P4C164-70DWM

This table gives cross-reference parts and alternative options found for P4C164-70DWM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164-70DWM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
P4C164L-70DWMLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164L-70DWMLF
FT6264L-70DWMB Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd P4C164-70DWM vs FT6264L-70DWMB
5962-8552511XX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, Electronic Designs Inc P4C164-70DWM vs 5962-8552511XX
P4C164-70CWMBLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164-70CWMBLF
5962-3829407MXA 8KX8 STANDARD SRAM, 70ns, CDIP28, CERAMIC, DIP-28 Motorola Mobility LLC P4C164-70DWM vs 5962-3829407MXA
P4C164L-70CWI Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164L-70CWI
FT6264L-70P6C Standard SRAM Force Technologies Ltd P4C164-70DWM vs FT6264L-70P6C
FT6164L-70L32MLF Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32 Force Technologies Ltd P4C164-70DWM vs FT6164L-70L32MLF
P4C164-70CWI Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164-70CWI
5962-3829448MZX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components P4C164-70DWM vs 5962-3829448MZX
Part Number Description Manufacturer Compare
AS5C4008CW-45/IT Standard SRAM, 512KX8, 45ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components P4C164-70DWM vs AS5C4008CW-45/IT
5962-9559506HAX SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components P4C164-70DWM vs 5962-9559506HAX
AS8S128K32QT-45/IT SRAM Module, 128KX32, 45ns, CMOS, CQFP68, 0.140 INCH HEIGHT, CERAMIC, QFP-68 Micross Components P4C164-70DWM vs AS8S128K32QT-45/IT
P4C164-100DWC Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164-100DWC
P4C164L-100CWMB Standard SRAM, 8KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-70DWM vs P4C164L-100CWMB
MT5C2568EC-25/IT Standard SRAM, 32KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28 Micross Components P4C164-70DWM vs MT5C2568EC-25/IT
5962-8855206TA Standard SRAM, 32KX8, 25ns, CMOS, CDFP28, CERAMIC, DFP-28 Micross Components P4C164-70DWM vs 5962-8855206TA
5962-9315603HYA Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32, DUAL CAVITY, BOTTOM BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 White Microelectronics P4C164-70DWM vs 5962-9315603HYA
5962-9461110HAX SRAM Module, 512KX32, 17ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp P4C164-70DWM vs 5962-9461110HAX
5962-9461116HAA SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp P4C164-70DWM vs 5962-9461116HAA

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