Datasheets
P4C164-35DMB by: Pyramid Semiconductor Corporation

Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28

Part Details for P4C164-35DMB by Pyramid Semiconductor Corporation

Overview of P4C164-35DMB by Pyramid Semiconductor Corporation

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Part Details for P4C164-35DMB

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P4C164-35DMB Part Data Attributes

P4C164-35DMB Pyramid Semiconductor Corporation
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P4C164-35DMB Pyramid Semiconductor Corporation Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
Additional Feature LG-MAX
I/O Type COMMON
JESD-30 Code R-CDIP-T28
JESD-609 Code e0
Length 37.719 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.715 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for P4C164-35DMB

This table gives cross-reference parts and alternative options found for P4C164-35DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C164-35DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28 Motorola Semiconductor Products P4C164-35DMB vs 5962-8552508XA
5962-3829427MZA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 LOGIC Devices Inc P4C164-35DMB vs 5962-3829427MZA
P4C164L-35PMBLF Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164L-35PMBLF
P4C164L-35DWCLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164L-35DWCLF
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28 Cypress Semiconductor P4C164-35DMB vs 5962-8552508XA
P4C164-35DWMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164-35DWMLF
5962-3829413MXA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc P4C164-35DMB vs 5962-3829413MXA
5962-3829426MXX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, LOGIC Devices Inc P4C164-35DMB vs 5962-3829426MXX
5962-3829427MZA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Micross Components P4C164-35DMB vs 5962-3829427MZA
P4C164L-35CMB Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164L-35CMB
Part Number Description Manufacturer Compare
P4C164L-12FM Standard SRAM, 8KX8, 12ns, CMOS, CDFP28, CERAMIC, DFP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164L-12FM
WS128K32N-45HQ SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp P4C164-35DMB vs WS128K32N-45HQ
P4C164-35CWMBLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164-35CWMBLF
P4C164-35PILF Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164-35PILF
WS128K32N-45HME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp P4C164-35DMB vs WS128K32N-45HME
P4C164L-35DWCLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation P4C164-35DMB vs P4C164L-35DWCLF
WS128K32N-25HSME SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp P4C164-35DMB vs WS128K32N-25HSME
5962-8868102XA Standard SRAM, 64KX4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 LOGIC Devices Inc P4C164-35DMB vs 5962-8868102XA
FTS128K32N-45H1BA Standard SRAM, 128KX32, 45ns, CMOS, CPGA66, CERAMIC, PGA-66 Force Technologies Ltd P4C164-35DMB vs FTS128K32N-45H1BA
FT6164L-35CMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Force Technologies Ltd P4C164-35DMB vs FT6164L-35CMLF

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