Part Details for NT6TL64M32CI-G0 by Nanya Technology Corporation
Overview of NT6TL64M32CI-G0 by Nanya Technology Corporation
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Applications
Computing and Data Storage
Part Details for NT6TL64M32CI-G0
NT6TL64M32CI-G0 CAD Models
NT6TL64M32CI-G0 Part Data Attributes
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NT6TL64M32CI-G0
Nanya Technology Corporation
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Datasheet
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NT6TL64M32CI-G0
Nanya Technology Corporation
DDR DRAM, 64MX32, CMOS, PBGA134, FBGA-134
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NANYA TECHNOLOGY CORP | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Samacsys Manufacturer | Nanya | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B134 | |
| Length | 11.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | LPDDR2 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 134 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 64MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11.5 mm |