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SoC, CMOS, PBGA75, WLCSP-75
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
82AK2526
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Newark | Transceiver, 2.4 Ghz |Nordic Semiconductor NRF52833-CJAA-R RoHS: Not Compliant Min Qty: 7000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$3.5500 | Buy Now |
DISTI #
4823-NRF52833-CJAA-RTR-ND
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DigiKey | IC RF TXRX+MCU 802.15.4 75WLCSP Min Qty: 7000 Lead time: 20 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$3.5500 | Buy Now |
DISTI #
NRF52833-CJAA-R
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Avnet Americas | NRF52833-CJAA HADRON WLCSP - Tape and Reel (Alt: NRF52833-CJAA-R) RoHS: Not Compliant Min Qty: 7000 Package Multiple: 7000 Lead time: 20 Weeks, 0 Days Container: Reel | 21000 |
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$2.3778 / $4.1600 | Buy Now |
DISTI #
949-NRF52833-CJAA-R
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Mouser Electronics | RF System on a Chip - SoC nRF52833-CJAA Hadron WLCSP RoHS: Compliant | 7904 |
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$2.8800 / $5.7300 | Buy Now |
DISTI #
NRF52833-CJAA-R
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Avnet Asia | NRF52833-CJAA HADRON WLCSP (Alt: NRF52833-CJAA-R) RoHS: Compliant Min Qty: 7000 Package Multiple: 7000 Lead time: 20 Weeks, 0 Days | 0 |
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RFQ | |
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Ozdisan Elektronik | BLUETOOTH IC RF TXRX+MCU ISM>1GHZ 2.4GHz WLCSP62 | 0 |
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$5.7185 / $6.2904 | RFQ |
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Symmetry Electronics | Bluetooth 5.1 SoC supporting Bluetooth mesh, Thread and Zigbee, qualified for up to 105 C ambient temperature Min Qty: 1 | In Stock |
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$3.4000 | Buy Now |
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NRF52833-CJAA-R
Nordic Semiconductor
Buy Now
Datasheet
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Compare Parts:
NRF52833-CJAA-R
Nordic Semiconductor
SoC, CMOS, PBGA75, WLCSP-75
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Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NORDIC SEMICONDUCTOR ASA | |
Package Description | WLCSP-75 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 20 Weeks | |
Samacsys Manufacturer | Nordic Semiconductor | |
JESD-30 Code | S-PBGA-B75 | |
Length | 3.175 mm | |
Number of Terminals | 75 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA75,9X9,14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 0.514 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.35 mm | |
Terminal Position | BOTTOM | |
Width | 3.175 mm | |
uPs/uCs/Peripheral ICs Type | SoC |