There are no models available for this part yet.
Overview of NMC27C32E-45 by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Industrial Automation
CAD Models for NMC27C32E-45 by National Semiconductor Corporation
Part Data Attributes for NMC27C32E-45 by National Semiconductor Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
|
|
Package Description
|
WINDOWED, CERAMIC, DIP-24
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
450 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T24
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
32768 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
4096 words
|
|
Number of Words Code
|
4000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
4KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Equivalence Code
|
DIP24,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.715 mm
|
|
Standby Current-Max
|
0.0001 A
|
|
Supply Current-Max
|
0.01 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for NMC27C32E-45
This table gives cross-reference parts and alternative options found for NMC27C32E-45. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C32E-45, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C32E-45 | 4KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 | Texas Instruments | NMC27C32E-45 vs NMC27C32E-45 |
| LD2732A-4 | UVPROM, 4KX8, 450ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | NMC27C32E-45 vs LD2732A-4 |
| 8001204JA | UVPROM, 4KX8, 450ns, NMOS, | Rochester Electronics LLC | NMC27C32E-45 vs 8001204JA |
| TD2732A-45 | UVPROM, 4KX8, 450ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | NMC27C32E-45 vs TD2732A-45 |
| AM2732B-450DI | UVPROM, 4KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32E-45 vs AM2732B-450DI |
| AM2732B-450DE | UVPROM, 4KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32E-45 vs AM2732B-450DE |
| AM2732B-455DC | UVPROM, 4KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32E-45 vs AM2732B-455DC |
| M2732A-4F1 | 4KX8 UVPROM, 450ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | NMC27C32E-45 vs M2732A-4F1 |
| AM2732B-455DI | UVPROM, 4KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32E-45 vs AM2732B-455DI |
| NMC27C32EH-45 | 4KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 | Texas Instruments | NMC27C32E-45 vs NMC27C32EH-45 |