Part Details for NMC27C32BQE250 by Texas Instruments
Overview of NMC27C32BQE250 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Part Details for NMC27C32BQE250
NMC27C32BQE250 CAD Models
NMC27C32BQE250 Part Data Attributes
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NMC27C32BQE250
Texas Instruments
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Datasheet
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NMC27C32BQE250
Texas Instruments
4KX8 UVPROM, 250ns, CDIP24, WINDOWED, CERAMIC, DIP-24
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | WDIP, DIP24,.6 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 32768 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.02 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for NMC27C32BQE250
This table gives cross-reference parts and alternative options found for NMC27C32BQE250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C32BQE250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TD2732A | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | NMC27C32BQE250 vs TD2732A |
8001203JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | Intel Corporation | NMC27C32BQE250 vs 8001203JX |
LD2732A | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | NMC27C32BQE250 vs LD2732A |
TMS2732A-25JP4 | 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Texas Instruments | NMC27C32BQE250 vs TMS2732A-25JP4 |
AM2732B-250/BJA | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32BQE250 vs AM2732B-250/BJA |
8001209JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | AMD | NMC27C32BQE250 vs 8001209JX |
LD2732A-25 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | NMC27C32BQE250 vs LD2732A-25 |
AM2732BDI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32BQE250 vs AM2732BDI |
AM2732BDC | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32BQE250 vs AM2732BDC |
AM2732B-250DI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C32BQE250 vs AM2732B-250DI |