Datasheets
NMC27C010QE200 by:

UVPROM, 128KX8, 200ns, CMOS, CDIP32

Part Details for NMC27C010QE200 by National Semiconductor Corporation

Overview of NMC27C010QE200 by National Semiconductor Corporation

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Applications Consumer Electronics

Price & Stock for NMC27C010QE200

Part # Distributor Description Stock Price Buy
Bristol Electronics   1
RFQ

Part Details for NMC27C010QE200

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NMC27C010QE200 Part Data Attributes

NMC27C010QE200 National Semiconductor Corporation
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NMC27C010QE200 National Semiconductor Corporation UVPROM, 128KX8, 200ns, CMOS, CDIP32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description CERAMIC, DIP-32
Reach Compliance Code unknown
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.969 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C010QE200

This table gives cross-reference parts and alternative options found for NMC27C010QE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C010QE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27CL010-20DM/883 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation NMC27C010QE200 vs AT27CL010-20DM/883
M27C1001-20XF1 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics NMC27C010QE200 vs M27C1001-20XF1
AM27C010-200DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NMC27C010QE200 vs AM27C010-200DC
DPV27C101-200B UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company NMC27C010QE200 vs DPV27C101-200B
5962-8961403XA UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NMC27C010QE200 vs 5962-8961403XA
AT27LV010-20DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation NMC27C010QE200 vs AT27LV010-20DC
AM27C010-200DEB UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NMC27C010QE200 vs AM27C010-200DEB
NMC27C010Q20 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 Texas Instruments NMC27C010QE200 vs NMC27C010Q20
DPV27C101-200C UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company NMC27C010QE200 vs DPV27C101-200C
AM27C010-200DEB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NMC27C010QE200 vs AM27C010-200DEB
Part Number Description Manufacturer Compare
AM27C100-200DIB UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NMC27C010QE200 vs AM27C100-200DIB
NM27C010QE200 UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 Fairchild Semiconductor Corporation NMC27C010QE200 vs NM27C010QE200
AM27C010-200DIB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NMC27C010QE200 vs AM27C010-200DIB
27C100-200V10 UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Intel Corporation NMC27C010QE200 vs 27C100-200V10
AM27C010-200DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NMC27C010QE200 vs AM27C010-200DC
HN27C301AG-20 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation NMC27C010QE200 vs HN27C301AG-20
TMS27C010A-20JE 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Texas Instruments NMC27C010QE200 vs TMS27C010A-20JE
AM27C010-205DC UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NMC27C010QE200 vs AM27C010-205DC
AT27CL010-20DM/883 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation NMC27C010QE200 vs AT27CL010-20DM/883
M27C1001-20XF1 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics NMC27C010QE200 vs M27C1001-20XF1

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