There are no models available for this part yet.
Overview of NMC2147HJ-3L by Texas Instruments
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for NMC2147HJ-3L by Texas Instruments
Part Data Attributes for NMC2147HJ-3L by Texas Instruments
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
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|
Part Package Code
|
DIP
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|
Package Description
|
DIP, DIP18,.3
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|
Pin Count
|
18
|
|
Reach Compliance Code
|
unknown
|
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ECCN Code
|
EAR99
|
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HTS Code
|
8542.32.00.41
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|
Access Time-Max
|
55 ns
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I/O Type
|
SEPARATE
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|
JESD-30 Code
|
R-GDIP-T18
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|
JESD-609 Code
|
e0
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Memory Density
|
4096 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
|
1
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Number of Functions
|
1
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Number of Ports
|
1
|
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Number of Terminals
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18
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Number of Words
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4096 words
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Number of Words Code
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4000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
4KX1
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Output Characteristics
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3-STATE
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Output Enable
|
NO
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Code
|
DIP
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|
Package Equivalence Code
|
DIP18,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
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Qualification Status
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Not Qualified
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Seated Height-Max
|
5.08 mm
|
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Standby Voltage-Min
|
4.5 V
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Supply Current-Max
|
0.125 mA
|
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Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
NMOS
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Temperature Grade
|
COMMERCIAL
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|
Terminal Finish
|
TIN LEAD
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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Terminal Position
|
DUAL
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Width
|
7.62 mm
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Alternate Parts for NMC2147HJ-3L
This table gives cross-reference parts and alternative options found for NMC2147HJ-3L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC2147HJ-3L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY2147-55DC | Standard SRAM, 4KX1, 55ns, CMOS, CDIP18, 0.300 INCH, CERDIP-18 | Rochester Electronics LLC | NMC2147HJ-3L vs CY2147-55DC |
| AM2147-55DE | Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | NMC2147HJ-3L vs AM2147-55DE |
| M38510/28903BVA | Standard SRAM, 4KX1, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 | SRI International Sarnoff | NMC2147HJ-3L vs M38510/28903BVA |
| AM9147-55PC | Standard SRAM, 4KX1, 55ns, MOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | AMD | NMC2147HJ-3L vs AM9147-55PC |
| AM2147-55DC | Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | NMC2147HJ-3L vs AM2147-55DC |
| AM21L47-55PC | Standard SRAM, 4KX1, 55ns, NMOS, PDIP18, PLASTIC, DIP-18 | AMD | NMC2147HJ-3L vs AM21L47-55PC |
| NMC2147HJ-3 | IC 4K X 1 STANDARD SRAM, 55 ns, CDIP18, CERAMIC, DIP-18, Static RAM | National Semiconductor Corporation | NMC2147HJ-3L vs NMC2147HJ-3 |
| M38510/23805BVX | Standard SRAM, 4KX1, 55ns, MOS, CDIP18, CERAMIC, DIP-18 | Rochester Electronics LLC | NMC2147HJ-3L vs M38510/23805BVX |
| D2147-3 | 4KX1 STANDARD SRAM, 55ns, CDIP18, CERAMIC, DIP-18 | Intersil Corporation | NMC2147HJ-3L vs D2147-3 |
| M38510/23805BVA | Standard SRAM, 4KX1, 55ns, MOS, CDIP18, CERAMIC, DIP-18 | Intel Corporation | NMC2147HJ-3L vs M38510/23805BVA |