Part Details for NM27LV010L200 by Texas Instruments
Overview of NM27LV010L200 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Healthcare
Part Details for NM27LV010L200
NM27LV010L200 CAD Models
NM27LV010L200 Part Data Attributes
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NM27LV010L200
Texas Instruments
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Datasheet
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NM27LV010L200
Texas Instruments
IC 128K X 8 UVPROM, 200 ns, CQCC32, WINDOWED, LCC-32, Programmable ROM
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Part Package Code | QFJ | |
| Package Description | WQCCN, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.09 mm | |
| Supply Current-Max | 0.015 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for NM27LV010L200
This table gives cross-reference parts and alternative options found for NM27LV010L200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27LV010L200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27LV010-200/BUA | UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV010L200 vs AM27LV010-200/BUA |
| NM27LV010C200 | IC 128K X 8 UVPROM, 200 ns, CQCC32, WINDOWED, CERAMIC, LCC-32, Programmable ROM | Texas Instruments | NM27LV010L200 vs NM27LV010C200 |
| AM27LV010-200LI | UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV010L200 vs AM27LV010-200LI |
| AM27LV010-200LC | UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV010L200 vs AM27LV010-200LC |
| AM27LV010-200LEB | UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV010L200 vs AM27LV010-200LEB |
| AM27LV010B-200LC | UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV010L200 vs AM27LV010B-200LC |