Part Details for NE5517AH-300 by LSI Corporation
Overview of NE5517AH-300 by LSI Corporation
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- Part Data Attributes: (Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for NE5517AH-300
NE5517AH-300 CAD Models
NE5517AH-300 Part Data Attributes
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NE5517AH-300
LSI Corporation
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NE5517AH-300
LSI Corporation
EEPROM, 2KX8, 300ns, Parallel, MOS, PQCC32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | QCCJ, LDCC32,.5X.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 300 ns | |
| Command User Interface | NO | |
| Data Polling | YES | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PQCC-J32 | |
| JESD-609 Code | e0 | |
| Memory Density | 16384 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Terminals | 32 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC32,.5X.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Toggle Bit | NO | |
| Write Cycle Time-Max (tWC) | 2 ms |