There are no models available for this part yet.
Overview of NAND04GW3B2DN6E by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
CAD Models for NAND04GW3B2DN6E by STMicroelectronics
Part Data Attributes for NAND04GW3B2DN6E by STMicroelectronics
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
|
|
Part Package Code
|
TSOP
|
|
Package Description
|
TSSOP, TSSOP48,.8,20
|
|
Pin Count
|
48
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
20 ns
|
|
Command User Interface
|
YES
|
|
Data Polling
|
NO
|
|
JESD-30 Code
|
R-PDSO-G48
|
|
JESD-609 Code
|
e3/e6
|
|
Length
|
18.4 mm
|
|
Memory Density
|
4194304 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Sectors/Size
|
4K
|
|
Number of Terminals
|
48
|
|
Number of Words
|
524288 words
|
|
Number of Words Code
|
512000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
512KX8
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSSOP
|
|
Package Equivalence Code
|
TSSOP48,.8,20
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Page Size
|
2K words
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Programming Voltage
|
3 V
|
|
Qualification Status
|
Not Qualified
|
|
Ready/Busy
|
YES
|
|
Seated Height-Max
|
1.2 mm
|
|
Sector Size
|
128K
|
|
Standby Current-Max
|
0.00005 A
|
|
Supply Current-Max
|
0.03 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
MATTE TIN/TIN BISMUTH
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Toggle Bit
|
NO
|
|
Width
|
12 mm
|
Alternate Parts for NAND04GW3B2DN6E
This table gives cross-reference parts and alternative options found for NAND04GW3B2DN6E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NAND04GW3B2DN6E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NAND04GW3B2DN1E | 512KX8 FLASH 3V PROM, 20ns, PDSO48, 12 X 20 MM, PLASTIC, ROHS COMPLIANT, TSOP-48 | STMicroelectronics | NAND04GW3B2DN6E vs NAND04GW3B2DN1E |
| NAND04GW4B2DN6F | 512KX8 FLASH 3V PROM, 20ns, PDSO48, 12 X 20 MM, PLASTIC, ROHS COMPLIANT, TSOP-48 | STMicroelectronics | NAND04GW3B2DN6E vs NAND04GW4B2DN6F |
| NAND04GW4B2DN6E | 512KX8 FLASH 3V PROM, 20ns, PDSO48, 12 X 20 MM, PLASTIC, ROHS COMPLIANT, TSOP-48 | STMicroelectronics | NAND04GW3B2DN6E vs NAND04GW4B2DN6E |
Related Parts for NAND04GW3B2DN6E
-
NAND02GW3B2DN6EFlash Memories
-
STR912FAW47X6TMicrocontrollers
-
LM2787TPSwitching Regulator or Controllers
-
L6201PSPeripheral Drivers
-
IRFR5305TRPBFPower Field-Effect Transistors
-
NB6L72MMNR2GMultiplexers or Switches
-
NCP300HSN45T1GPower Management Circuits
-
KSZ8995MAINetwork Interfaces
-
DS90LV001TMXLine Driver or Receivers