There are no models available for this part yet.
Overview of N82S23B by Philips Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Consumer Electronics
Computing and Data Storage
CAD Models for N82S23B by Philips Semiconductors
Part Data Attributes for N82S23B by Philips Semiconductors
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|
|---|---|
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Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
|
SIGNETICS CORP
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Package Description
|
,
|
|
Reach Compliance Code
|
unknown
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.71
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Access Time-Max
|
50 ns
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JESD-30 Code
|
R-PDIP-T16
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Memory Density
|
256 bit
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Memory IC Type
|
OTP ROM
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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16
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Number of Words
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32 words
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Number of Words Code
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32
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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75 °C
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Operating Temperature-Min
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Organization
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32X8
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Output Characteristics
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OPEN-COLLECTOR
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
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Qualification Status
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Not Qualified
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|
Supply Voltage-Max (Vsup)
|
5.25 V
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|
Supply Voltage-Min (Vsup)
|
4.75 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
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BIPOLAR
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Temperature Grade
|
COMMERCIAL EXTENDED
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Terminal Form
|
THROUGH-HOLE
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Terminal Position
|
DUAL
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Alternate Parts for N82S23B
This table gives cross-reference parts and alternative options found for N82S23B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of N82S23B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 82S123/BEA | IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | N82S23B vs 82S123/BEA |
| 5962-8670301EA | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 | Lansdale Semiconductor Inc | N82S23B vs 5962-8670301EA |
| MB7111LCZ | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERDIP-16 | FUJITSU Semiconductor Limited | N82S23B vs MB7111LCZ |
| N82S23B | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | Signetics | N82S23B vs N82S23B |
| N82S23N | IC 32 X 8 OTPROM, 50 ns, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Programmable ROM | NXP Semiconductors | N82S23B vs N82S23N |
| 5962-8670301EX | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 | YAGEO Corporation | N82S23B vs 5962-8670301EX |
| N82S23N | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | YAGEO Corporation | N82S23B vs N82S23N |
| N82S23F | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, | Signetics | N82S23B vs N82S23F |
| 82S23/BEA | IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | N82S23B vs 82S23/BEA |
| AM27S19/BEA | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 | AMD | N82S23B vs AM27S19/BEA |