There are no models available for this part yet.
Overview of N82S136F by Philips Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
CAD Models for N82S136F by Philips Semiconductors
Part Data Attributes for N82S136F by Philips Semiconductors
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|---|---|
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Rohs Code
|
No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
|
PHILIPS SEMICONDUCTORS
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Package Description
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DIP, DIP18,.3
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.71
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Access Time-Max
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60 ns
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JESD-30 Code
|
R-XDIP-T18
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JESD-609 Code
|
e0
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Memory Density
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4096 bit
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Memory IC Type
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OTP ROM
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Memory Width
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4
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Number of Terminals
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18
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Number of Words
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1024 words
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Number of Words Code
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1000
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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|
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Organization
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1KX4
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Package Body Material
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CERAMIC
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Package Code
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DIP
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Package Equivalence Code
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DIP18,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Qualification Status
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Not Qualified
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Surface Mount
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NO
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Technology
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TTL
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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