There are no models available for this part yet.
Overview of MZ736E3 by Microsemi Corporation
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
CAD Models for MZ736E3 by Microsemi Corporation
Part Data Attributes for MZ736E3 by Microsemi Corporation
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Package Description
|
O-LALF-W2
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8541.10.00.50
|
Additional Feature
|
METALLURGICALLY BONDED
|
Case Connection
|
ISOLATED
|
Configuration
|
SINGLE
|
Diode Element Material
|
SILICON
|
Diode Type
|
ZENER DIODE
|
JESD-30 Code
|
O-LALF-W2
|
Number of Elements
|
1
|
Number of Terminals
|
2
|
Operating Temperature-Max
|
175 °C
|
Operating Temperature-Min
|
-65 °C
|
Package Body Material
|
GLASS
|
Package Shape
|
ROUND
|
Package Style
|
LONG FORM
|
Polarity
|
UNIDIRECTIONAL
|
Power Dissipation-Max
|
3 W
|
Reference Voltage-Nom
|
36 V
|
Surface Mount
|
NO
|
Technology
|
ZENER
|
Terminal Form
|
WIRE
|
Terminal Position
|
AXIAL
|
Voltage Tol-Max
|
5%
|
Working Test Current
|
20 mA
|